ASEAN+ Youth Summit 2023 (A+YS) Extended Round Submission (CLOSED)

Application Round is now Closed! No submission will be accepted. Thank You.

 

Application Rounds:

1. Regular Round:

The main time frame for prospective applicants that wish to attend A+YS. Applicants must submit their submission through the Regular Submission round to be considered for Scholarships support.

2. Scholarship Consideration:


Applicants who are shortlisted on Regular Submissions round will be considered to receive a Scholarship based on Regular Submission application.

3. Extended Round:

Additional time frame for applicants to apply and secure invitation at A+YS, but slots are limited. Acceptance decisions will be announced at a later date and reviewed on a rolling basis.

(CLOSED)

 

Key Dates for Submissions:

1. Regular Round Submissions Open: July 10th, 2023.

2. Regular Round Submissions Close: July 31st, 2023.

3. Scholarship Shortlist Process Begin: August 2nd, 2023 (Shortlisted from regular round applicant submission)
.

4. Scholarship Shortlist Result Announcement: August 15th, 2023 (Shortlisted from regular round applicant submission).

5. Extended Round Registration Open: August 1st, 2023 (All applications will be reviewed on a rolling basis).

6. Extended Round Registration Close: September 6th, 2023 (All applications will be reviewed on a rolling basis).

(ALL ROUND CLOSED)

 

Scholarship consideration only applicable to shortlisted applicants on the regular round. A+YS committee will not accept any late submissions.

You will receive correspondences through an email, If selected for the next round of the submission process, you may have to schedule brief interview with A+YS committee member.

Please note that you must be 18 or older to be eligible to attend the conference in person.

For further inquiry please email aseanyouth2023@indonesianyouthdiplomacy.org

ASEAN+ Youth Summit 2023 (A+YS) Extended Round Submission (CLOSED)

Thanks for your interest in ASEAN+ Youth Summit 2023! Please complete the form below.

Interests and Submissions

Please complete the form below.